Technology bokgoni - Golden Triangle PCB & Technologies Co., Ltd
  • Phone: 86-0755- 85275761
  • E-mail: sales@gtpcb.com

    Technology bokgoni

    tenyetseheng
    Tlhaloso bokgoni
    1.Product Range 2-30L (HDI: 1 + N + 1; 2 + N + 2)
    2.Board botenya 0.2mm-7.0mm
    3.Copper Foil Inner: 6oz, Outer: 4oz
    4.Board botenya 'mamello +/- 10% - + / - 8%
    5.Material FR4, KB, PTFE, Rogers, ARLON, ISOLA, TACONIC, IT180, Nelco
    6.Surface kalafo HASL, HASL Pele free, OSP, Plating khauta (1appa "-50u") ENIG (1appa "-8u") Khauta Finger (1appa "-50u") ho qoelisoa silevera, qoelisoa Tin (0.8-1.5um)
    7.Size ba se felile sehlahiswa Mets: 10 * 10mm, Max: 1200 * 500mm
    8.Min. phetha molao ka tsela mekoti & sebaka Mekoti: 0.2mm / sebaka: 0.4mm
    9.Min Laser cheka mekoti & sebaka 0.1mm, sebaka <0.1mm
    10.Min. mamello lesoba +/- 0.05mm (NPTH), +/- 0.075mm (PTH)
    11.Min koporo botenya ba holes'wall 20um
    12.Min sebaka sa le masoba ho cheka ho mokhanni  0.15mm (<8L); 0.2 (8 <14); 0.225mm (<= 24L)
    13.Min. mokhanni bophara / sebaka 0,075 / 0.075mm (3 / 3mil)
    14.Min boholo ba solder sebaka / Annulus Sebaka: 0.4mm / 0.3mm (Laser dille), Annulus: 0.1mm
    15.Hole leboteng ho mokhanni Innerlayers tsa multilayer 0.2mm
    16.Hole ho lesoba bohale lekhalo 0.8mm
    17.Solder maske mala & botenya Mala: Green, le Letšo, Yellow, Blue, Red, White, Matt tala botenya: 10-20um
    18.Silk-skrine mmala Tšoeu, le Letšo, Yellow
    19.Profile mamello +/- 0.15mm (Routing), +/- 0.1mm (otla ka litebele)
    20.Min sebaka ho tloha mokhanni oa / masoba ho bohale 0.15mm / 0.2mm
    21.Warp & sotha  0,3% -0,7%
    22.Thickness tsa peelablemask 0.2-0.5mm (Max plugging mekoti: 4.5mm)
    23.Bevel angle ea monoana khauta 20,30,45,60 (mamello: +/- 5 lengolo la)
    24.Impedance mamello +/- 5ohm
    25.V-khaola boto le tsona ka botenya 0.6-3.0mm
    26. Max selotlolo o tobetsa <= 3
    27.Min mamello ea sekotjana siloa +/- 0.15mm
    28.Ratio tsa boto le tsona ka botenya / masoba ka boholo 12: 1