Technology Capability - Golden onigun PCB & Technologies Co., Ltd
  • Phone: 86-0755- 85275761
  • E-mail: sales@gtpcb.com

    Technology Capability

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    Apejuwe agbara
    1.Product Range 2-30L (HDI: 1 + N + 1; 2 + N + 2)
    2.Board sisanra 0.2mm-7.0mm
    3.Copper Bankanje Akojọpọ: 6oz, Lode: 4oz
    4.Board sisanra 'ifarada +/- 10% - + / - 8%
    5.Material FR4, KB, ptfe, Rogers, ARLON, ISOLA, TACONIC, IT180, Nelco
    6.Surface itọju HASL, HASL Lead free, OSP, bar wura (1u "-50u") ENIG (1u "-8u") Gold ika (1u "-50u") immersion fadaka, immersion Tin (0.8-1.5um)
    7.Size ti pari ọja Min: 10 * 10mm, Max: 1200 * 500mm
    8.Min. darí nipasẹ ihò & pad Ihò: 0.2mm / pad: 0.4mm
    9.Min lesa liluho ihò & pad 0.1mm, pad <0.1mm
    10.Min. iho ifarada +/- 0.05mm (NPTH), +/- 0.075mm (PTH)
    11.Min Ejò sisanra ti holes'wall 20um
    12.Min aaye ti liluho ihò to adaorin  0.15mm (<8L); 0.2 (8 <14); 0.225mm (<= 24L)
    13.Min. adaorin iwọn / aaye 0,075 / 0.075mm (3 / 3mil)
    14.Min iwọn ti solder pad / Annulus Pad: 0.4mm / 0.3mm (lesa dill), Annulus: 0.1mm
    15.Hole odi to adaorin Innerlayers ti multilayer 0.2mm
    16.Hole to iho eti aafo 0.8mm
    17.Solder boju awọ & Sisanra Awọ: Green, Black, Yellow, Blue, Red, White, Matt ewe Sisanra: 10-20um
    18.Silk-iboju awọ White, Black, Yellow
    19.Profile ifarada +/- 0.15mm (afisona), +/- 0.1mm (punching)
    20.Min aaye lati adaorin / ihò to eti 0.15mm / 0.2mm
    21.Warp & lilọ  0.3% -0,7%
    22.Thickness ti peelablemask 0.2-0.5mm (Max plugging ihò: 4.5mm)
    23.Bevel igun kan ti wura ika 20,30,45,60 (ifarada: +/- 5 ìyí)
    24.Impedance ifarada +/- 5ohm
    25.V-ge ọkọ sisanra 0.6-3.0mm
    26. Max olona-tẹ <= 3
    27.Min ifarada ti milling Iho +/- 0.15mm
    28.Ratio ti ọkọ sisanra / ihò iwọn 12: 1