| Material | Polyimide | Polyester | Remarks and Testing |
| Layers | 1-6 Layers | 1-2 Layers | |
| Max. Panel Size | 300mm*1000mm | ||
| Min.Track Width/Space | 0.051mm/0.051mm | ||
| Min. Board Thickness | Single：0.1mm | ||
| 2 layers：0.13mm | |||
| 4 layers：0.30mm | |||
| 6 layers：0.50mm | |||
| Min. Hole Size | Drill Hole: 0.20mm | ||
| Punching Hole：0.50mm | |||
| Aspect Ratio | 6:1 | ||
| Base Copper | 1/3Oz — 3Oz | ||
| Size Tolerance | Conductor Width：±10% | W ≤ 0.5mm | |
| Hole Size： ±0.05mm | H ≤ 1.5mm | ||
| Hole Registration： ±0.050mm | |||
| Outline Tolerance：±0.075mm | L ≤ 50mm | ||
| Surface Treatment | ENIG: 0.025um – 3um | ||
| Immersion Tin: 0.04-1.5um | |||
| Hard Gold | |||
| Dielectric Strength | AC500V | ||
| Solder Float | 288℃/10s | ||
| Peeling Strength | 1.0kgf/cm | IPC-TM-650 | |
| Flammability | 94V-O | UL94 | |
