hentitra |
Description |
fahaiza-manao |
1.Product Range |
2-30L (HDI: 1 + N + 1, 2 + N + 2) |
2.Board hateviny |
0.2mm-7.0mm |
3.Copper Foil |
Inner: 6oz, ivelany: 4oz |
4.Board hateviny 'fandeferana |
+/- 10% - + / - 8% |
5.Material |
FR4, KB, PTFE, Rogers, ARLON, Isola, TACONIC, IT180, Nelco |
6.Surface fitsaboana |
HASL, HASL Lead maimaim-poana, OSP, voapetaka volamena (1u "-50u") ENIG (1u "-8u") bolamena Finger (1u "-50u") Ny firobohana lalina volafotsy, Ny firobohana lalina Tin (0.8-1.5um) |
7.Size ny vokatra vita |
Min: 10 * 10mm, Max: 1200 * 500mm |
8.Min. mekanika alalan'ny lavaka & pad |
Lavaka: 0.2mm / pad: 0.4mm |
9.Min Laser ary atsofony lavaka & pad |
0.1mm, pad <0.1mm |
10.Min. lavaka fandeferana |
+/- 0.05mm (NPTH), +/- 0.075mm (PTH) |
11.Min varahina sakan'ny holes'wall |
20um |
12.Min toerana ny lavaka ary atsofony ny mpitarika |
0.15mm (<8L), 0.2 (8 <14); 0.225mm (<= 24L) |
13.Min. mpitarika sakany / toerana |
0,075 / 0.075mm (3 / 3mil) |
14.Min haben'ny solder pad / Annulus |
Pad: 0.4mm / 0.3mm (Laser aneta), Annulus: 0.1mm |
15.Hole manda mpitarika Innerlayers ny multilayer |
0.2mm |
16.Hole ny sisin'ny lavaka elanelana |
0.8mm |
17.Solder saron-tava loko & hateviny |
Color: Green, Black, Yellow, Blue, Red, White, Matt maitso hatevin'ny: 10-20um |
18.Silk-efijery loko |
White, Black, Yellow |
19.Profile fandeferana |
+/- 0.15mm (tambazotra), +/- 0.1mm (Punching) |
20.Min toerana avy amin'ny mpitarika / lavaka eny amin'ny sisin'ny |
0.15mm / 0.2mm |
21.Warp & manova |
0.3% -0,7% |
22.Thickness ny peelablemask |
0.2-0.5mm (Max tonga dia mandefa radio lavaka: 4.5mm) |
23.Bevel zoro volamena rantsan- |
20,30,45,60 (Tolerance: +/- 5 diplaoma) |
24.Impedance fandeferana |
+/- 5ohm |
25.V-NANAPAKA board hatevin'ny |
0.6-3.0mm |
26. Max multi-gazety |
<= 3 |
27.Min fandeferana ny fikosoham-bary slot |
+/- 0.15mm |
28.Ratio ny birao hatevin'ny / lavaka habe |
12: 1 |