| Mārō-whakatautau | |
| Whakaahuatanga | āheinga |
| Awhe 1.Product | 2-10L (HDI: 1 + N + 1: 2 + N + 2) |
| matotoru 2.Board | 0.2mm-3.0mm |
| 3.Copper konumohe | Inner: 3oz, waho: 4oz |
| kātakí matotoru 4.Board ' | +/- 10% - + / - 8% |
| 5.Material | FR4 + PI |
| maimoatanga 6.Surface | HASL, HASL Lead free, OSP, Plating gold(1u”-50u”) ENIG(1u”-8u”) Gold Finger(1u”-50u”) Immersion silver, Immersion Tin(0.8-1.5um) |
| 7.Size o hua oti | Min: 10 * 10mm, Max: 1200 * 500mm |
| 8.Min. pūkaha mā rua & papa | Holes: 0.2mm / papa: 0.4mm |
| 9.Min Taiaho rua kōhao & papa | 0.1mm, papa <0.1mm |
| 10.Min. kātakí poka | +/- 0.05mm (NPTH), +/- 0.075mm (PTH) |
| 11.Min parahi matotoru o holes'wall | 20um |
| 12.Min wāhi o rua kōhao ki te pēne | 0.15mm(<8L);0.2(8<14);0.225mm(<=24L) |
| 13.Min. kaiwhakahaere whanui / wāhi | 0,075 / 0.075mm (3 / 3mil) |
| 14.Min rahi o te tūhoto PAD / Annulus | Pad: 0.4mm / 0.3mm (taiaho kōhao), Min.annual mowhiti: 0.1mm |
| taiepa 15.Hole ki Innerlayers kaiwhakahaere o multilayer | 0.2mm |
| 16.Hole ki poka mata āputa | 0.8mm |
| 17.Solder tae kanohi & Matotoru | Tae: Green, Black, Yellow, Blue, Whero, White, Matt Matotoru matomato: 10-20um |
| tae 18.Silk-mata | White, Black, Kōwhai |
| 19.Profile kātakí | +/- 0.15mm (Ararere), +/- 0.1mm (pahaki) |
| 20. Min wāhi i pēne / rua ki te niao | 0.15mm / 0.2mm |
| 21.Warp & tea | 0.3%-0.7% |
| 22.Thickness o peelablemask | 0.2-0.5mm (Max rua plugging: 4.5mm) |
| 23.Bevel koki o te maihao koura | 20,30,45,60 (kātakí: +/- 5 tohu) |
| 24.Impedance kātakí | +/- 5ohm |
| matotoru poari 25.V-CUT | 0.6-3.0mm |
| 26. Max maha-press | <= 3 |
| 27.Min kātakí o mira mokamoka | +/- 0.15mm |
| 28.Ratio o matotoru poari / rahi rua | 12: 1 |
