| Rigid | |
| Description | Capabilities |
| 1．Product Range | 2-30L（HDI：1+N+1；2+N+2） |
| 2．Board thickness | 0.2mm—7.0mm |
| 3．Copper Foil | Inner: 6oz, Outer: 4oz |
| 4．Board thickness’ tolerance | +/-10%—–+/-8% |
| 5．Material | FR4, KB , PTFE, ROGERS, ARLON, ISOLA, TACONIC, IT180, Nelco |
| 6．Surface treatment | HASL, HASL Lead free, OSP,Plating gold(1u”-50u”) ENIG(1u”-8u”) Gold Finger(1u”-50u”) Immersion silver, Immersion Tin(0.8-1.5um) |
| 7．Size of finished product | Min: 10*10mm, Max: 1200*500mm |
| 8．Min. mechanical via holes & pad | Holes: 0.2mm/pad: 0.4mm |
| 9．Min Laser drilling holes & pad | 0.1mm, pad<0.1mm |
| 10．Min. hole tolerance | +/-0.05mm(NPTH), +/-0.075mm(PTH) |
| 11．Min copper thickness of holes’wall | 20um |
| 12．Min space of drilling holes to conductor | 0.15mm(<8L);0.2(8<14);0.225mm(<=24L) |
| 13．Min. conductor width/space | 0.075/0.075mm(3/3mil) |
| 14．Min size of solder PAD/Annulus | Pad:0.4mm/0.3mm(Laser dill), Annulus:0.1mm |
| 15．Hole wall to conductor Innerlayers of multilayer | 0.2mm |
| 16．Hole to hole edge gap | 0.8mm |
| 17．Solder mask color & Thickness | Color: Green, Black, Yellow, Blue, Red, White, Matt green Thickness: 10-20um |
| 18．Silk-screen color | White, Black, Yellow |
| 19．Profile tolerance | +/-0.15mm(Routing), +/-0.1mm(Punching) |
| 20.Min space from conductor/holes to edge | 0.15mm/0.2mm |
| 21．Warp & twist | 0.3%-0.7% |
| 22．Thickness of peelablemask | 0.2-0.5mm (Max plugging holes: 4.5mm) |
| 23．Bevel angle of gold finger | 20，30，45，60(Tolerance: +/-5 degree) |
| 24．Impedance tolerance | +/-5ohm |
| 25．V-CUT board thickness | 0.6-3.0mm |
| 26. Max multi-press | <=3 |
| 27．Min tolerance of milling slot | +/-0.15mm |
| 28．Ratio of board thickness/holes size | 12:1 |
