2024-07-29
At present, based on customers' design, normally we have four different methods to deall with the Via through holes:
First one: Via opening
It can be understood as no solder mask on the through holes to expose welding ring for testing or installing plug-in components.
Second one: Via hole plugging with solder mask ink
It means that the through holes are fully filled in with solder mask ink before solder mask process. Tin leaking that Tin exudes from through holes to component side during reflow soldering, which will results in short circuit. Via hole plugging with solder mask ink can solve this problem.
Third one: Via filled with resin
After via filled with resin, the via will be plated over for via in pad. Such method will save the space for SMT component.
Forth one: Via copper paste plugging
Thanks to its high thermal conductivity, via copper paste plugging is usually used in high-power board such as lighting PCB etc.
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