PCB Solder Pad Design Standard - SMT Solder Pad Naming Rule Suggestions

(Inch: IN; metric millimeter with MM, the decimal point in the middle of the data with d, the following data are some of the size parameters of the components, these parameters can determine the size and shape of the pad. (Separated by "X" between different parameters)

Ordinary resistance (R), capacitance (C), inductance (L), magnetic beads (FB) class components (component shape rectangular)

Component type + size system + appearance size specifications named.

Such as: FBIN1206, LIN0805, CIN0603, RIN0402, CIN0201;

Row resistance (RN), row capacity (CN): component type + size system + size specifications + P + number of pins named

Such as: RNIN1206P8. on behalf of the resistance, external specifications size 1206, a total of 8 pins;

Tantalum capacitor (TAN): component type + size system + external size specifications named

Such as: TANIN1206, representing tantalum capacitor, its external size is 1206;

Aluminum electrolytic capacitor (AL): component type + size system + external size (diameter of upper part X height of component) specification

For example: ALMM5X5d4, representing aluminum electrolytic capacitor, the diameter of the upper part is 5mm and the height of the element is 5.4mm;

Diode (DI): Here mainly refers to the diode with two electrodes

Divided into two categories:

Planar diode (DIF): component type + size system + and PCB contact part of the pin size specifications (length X width) + X + pin span size named.

Such as: DIFMM1d2X1d4X2d8. indicates that the plane type diode, the pin length 1.2mm, width 1.4mm, the span between the pins is 2.8mm;

Cylindrical diode (DIR): component type + size system + external size specifications named.

DIRMM3d5X1d5. said cylindrical diode, external dimensions of 3.5mm long, 1.5mm wide

Transistor type components (SOT type and TO type): directly named with standard specification name

Such as SOT-23, SOT-223, TO-252, TO263-2 (two-pin type), TO263-3 (three-pin type).

SOP type components: as shown in the figure

Naming rules: SOP + size system + size e + X + size a + X + size d + X + pin center distance p + X + number of pins j

Such as: SOPMM6X0d8X0d42X1d27X8. represents SOP components, e=6mm,a=0.8mm,d=0.42mm,p=1.27mm,j=8

SOJ type components: as shown in the figure

Naming rules: SOJ + size system + size g + X + size d2 + X + pin center distance p + X + number of pins j

Such as SOJMM6d85X0d43X1d27X24. represents SOJ components, g=6.85mm,d2=0.43mm,p=1.27mm,j=24

PLCC type components: as shown in the figure

Naming rules: PLCC + size system + size g1 +X+ size g2 +X+ size d2 +X+ pin center distance p+X+ number of pins j

For example: PLCCMM15d5X15d5X0d46X1d27X44. represents PLCC components, g1=15.5mm,g2=15.5mm,d2=0.46mm,p=1.27mm,j=44

QFP type components: as shown in the figure

Naming rules: QFP + size system + size e1 +X+ size e2 +X+ size a +X+ size d +X+ pin center distance p+X+ number of pins j

For example: QFPMM30X30X0d6X0d16X0d4X32. represents QFP components, e1=30mm,e2=30mm,a=0.6mm,d=0.16mm,p=0.4mm,j=32

QFN type components: as shown in the figure

Naming rules: QFN + size system + size b1 + X + size b2 ( + X + size w1 + X + size w2 ) + X + size a + X + size d + X + pin center distance p + X + number of pins j

Such as: QFNMM5X5X3d1X3d1X0d4X0d3X0d8X32. represents QFN components, b1=5mm,b2=5mm,w1=3.1mm,w2=3.1mm,a=0.4mm,d=0.3mm,p=0.8mm,j=32

If there is no grounding pad, the red part is removed.

Other types of components: use the material number to name the pad size

Such as 5400-997100-10, 6100-150002-00, 6100-151910-01, 5700-ESD002-00, 5400-997000-50 and other irregular, complex components.