2024-03-21
Processes |
Details |
Pics |
Step 1: Preparation |
1. Generate SMT coordinate file according to Gerber file & BOM List
2. SMT programme
3. Prepare components
4. Arrange well inspection personnel for IPQC |
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Step 2: Laser Steel Mesh |
Laser steel mesh in line with pad layer. make hollow-out position of the steel mesh consistent with pads on the PCB, so that solder paste covers accurately the pads. |
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Step 3: Solder Paste Printing |
Cover the pads with solder paste |
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Step 4: 3D SPI Solder Paste Detection |
With the help of optical image technique to detect the condition of solder paste, such as offset, proportion, height, short circuit, etc.
It aims to screen poor printing PCB in time. |
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Step 5: SMT |
To place components on PCB with the help of Sm471 plus high-speed SMT machine & Sm481 PLUS multifunctional SMT machine |
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Step 6: Reflow Soldering |
To fix components on PCB |
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Step 7: AOI Detection |
To inspect whether the appearance & welding spot of the components meet requirement. |
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