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Detail Information

PCB Type: Rigid PCB Layer: Multi-layer
Base Material: FR-4 Solder Mask: Blue
Silk Screen: White Surface Treatment: Lead-free HASL

Product Description


Professional Multi Layer Air Purifier/Air Cleaner Circuit Control Board PCBA Design And Manufacturing


Description Capability


Smart electronics PCBA

Supplier Type Custom made

Copper thickness

3 oz

Board thickness



Designing and manufacturing a multi-layer air purifier or air cleaner circuit control board PCBA (Printed Circuit Board Assembly) involves several steps and considerations. Here's a description of the process:


Requirements Gathering: Understand the specific requirements for the air purifier or air cleaner circuit control board. Consider factors such as the desired functionality, input/output interfaces, sensors, user interface elements, connectivity options, and power requirements. Gather all necessary technical specifications and design constraints.


Schematic Design: Create a schematic diagram that represents the electrical connections and components required for the control board. The schematic design should include power supply circuits, micro-controllers or processors, sensor interfaces, communication interfaces, display elements, and any other relevant components. Ensure that the design meets safety and regulatory standards.


PCB Layout Design: Translate the schematic design into a physical PCB layout. This involves placing the components on the PCB and routing the traces to establish the necessary electrical connections. Pay attention to factors such as component placement, signal integrity, power distribution, and thermal management. A multi-layer PCB design is typically used to accommodate the complexity of the circuit and optimize space utilization.


PCB Fabrication: Once the PCB layout design is finalized, the PCB fabrication process begins. This involves manufacturing the actual circuit board based on the design. The process includes printing the circuit pattern onto the board substrate, etching to remove unnecessary copper, and applying solder mask and silkscreen layers. The number of layers and the material choice depend on the complexity and performance requirements of the control board.


Component Sourcing: Source the required electronic components for the PCBA assembly. This includes micro controllers or processors, sensors, memory chips, power supply modules, communication modules, display elements, and other relevant components. Work with trusted suppliers to procure high-quality components that meet the specifications of the control board.


Component Placement: Place the components on the PCB based on the PCB layout design. Skilled technicians or automated pick-and-place machines carefully position the components according to the design specifications. Attention to detail and accuracy is crucial to ensure proper alignment and orientation of the components.


Soldering: After component placement, the PCB assembly goes through the soldering process to create electrical connections between the components and the PCB. Various soldering techniques can be used, such as reflow soldering for surface-mounted components and wave soldering for through-hole components. These processes ensure secure and reliable connections.

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